No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
WET
Automatic Electroplating
Applications: Piller, Bump, RDL, TSV
Wafer size: 6, 8, 12-inch
Configuration: 2 load ports, up to 8 chambers
Electroplating solution: Cu, Ni, Sn/ Ag, Au
Pre-wetting and cleaning function
Horizontal chamber without cross contamination
Separation technology of cathode and anode for better stability of electroplating solution
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