No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
CMP
XS - 150 Smart
Excellent performance: Polishing/cleaning
Process mode: Dry in dry out Used in third-generation semiconductor, MEMS and other manufacturing processes.Multi zone polishing head
Compatible with 6/8- inch wafers Flexible process matching High output rate Meet mature process technology requirements
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