No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
Transfer Mold: XSKJ-180T Fully Automatic Molding System
The 180T fully automatic Molding system integrates the automatic supply of lead frame and compound, load unit, unload unit, press, mold and product automatic de-flash and collection device. It is suitable for medium and high-end IC integrated circuit packages such as: BGA/QFN/QFP/SOT/SOP/DIP.
Reasonable design structure of the mold frame, flexible disassembly of each component, to ensure convenient maintenance, equipped with a variety of detection methods such as the presence of material sheets, positive and negative, modular design, realize the free combination of feeding unit, press unit and lowering unit, can be adapted to 1 to 4 press units.
Number of packages: 2 L/F times/press.
Applicable L/F Size: length: 124-300mm, thickness: 0.1-0.6mm
Mold closing pressure: 98~1760kN (maximum 180 tons)
Injection molding pressure: 4. 9~29. 4kN (maximum 3 tons)
Dimension: L*W*H:2559*2610*2050(mm)
Weight: 12T