No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
die-bond equipment
Epoxy: JYQ812 Automatic Semiconductor Planar High Speed Die Bonder
Equipment Introduction
JYQ812 (automatic semiconductor plane high speed die bonder) is suitable for the die bonding process of epoxy resin adhesive and conductive silver adhesive for IC frame and substrate.
Equipment Features:
- Linear motor is applied to drive double dispensing system.
- High precision linear motor drive die bonder, voice coil torsion loop controls die bond pressure accurately.
- High-precision die platform searching, servo motor driving die angle correction system, equipped with 12-inch wafer automatic film expansion system.
- A separate dispensing control system is adopted to make a precise control of dispensing amount.
- Vacuum die missing testing technology is adopted.
- IPC control the operation of equipment, simplifying the operation of automation equipment;
Accuracy of die bonding position: ±20μm
Chip rotation accuracy: ±1°
Equipment stability data: MTBA≥1 hour; MTBF≥168 hours
Equipment size: 2050×1350×1900mm (add trichromatic lamp)
Equipment weight: 1820kg
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