No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
Molding
The molding machine assembles the chip and lead frame in a hard plastic shell. It can provide moisture-proof, damp-proof, dust-proof, pollution-proof, mechanical damage prevention, electrical performance optimization and other functions for the device.
Working principle:
First, place the chip and the lead frame to be assembled in the die cavity of the mold. The mold is usually composed of two parts, which form a sealed cavity when mold closing.
Preheating: The mold is heated to a temperature suitable for the flow of the plastic sealing material, usually in the range of 150 ° C ~200 ° C, to ensure that the plastic sealing material can fill the mold cavity smoothly.
Mold closing: The upper and lower parts of the mold are closed to fix the chip and lead frame in the mold cavity.
Material injection: Molten plastic sealing material (such as epoxy resin) is injected into the mold. The material enters the mold cavity through the gate, flows and wraps around the chip and lead frame.
Curing: It is heated in the mold and kept for a certain time to cure the plastic sealing material and form a hard assembly shell.
Demolding: After curing, the mold is opened and the assembled semiconductor device can be taken out.
