Fine Al Wire Bonding Machine

 Gold wire bonding machine is the key equipment used to realize the electrical connection between the chip and the substrate in the semiconductor assembly process.
Working principle:
Thermal ultrasonic bonding: The gold wire bonding machine mainly uses thermal ultrasonic bonding technology, combining heat, pressure and ultrasonic energy to form a solid connection between the gold wire and the chip pad and the substrate pad.
It is widely used in various types of integrated circuit assembly, such as QFP, BGA, CSP, etc., to connect the chip with the lead frame or substrate, so as to realize the electrical interconnection between the chip and the external circuit.

Coarse Al Wire Bonding Machine

Thin aluminum wire bonding machine is used to bond aluminum wire with semiconductor chips, substrates or other electronic components, and is widely used in the field of electronic assembly.
Working principle:
Ultrasonic bonding: The thin aluminum wire bonding machine mainly uses ultrasonic bonding technology. The high-frequency sinusoidal power signal generated by the ultrasonic generator is transformed into mechanical vibration by piezoelectric ceramics. These vibrations act on the bonding interface through transmission amplification and convergence.
It is widely used in integrated circuit assembly to connect the pad on the chip to the lead frame or the pad on the substrate to realize the electrical interconnection between the chip and the external circuit.

Au/Cu Wire Bonding Machine

Thick aluminum wire bonding machine is used to bond aluminum wire with semiconductor chips, substrates or other electronic components, and is widely used in the field of electronic assembly.
Working principle:
Ultrasonic bonding: The thick aluminum wire bonding machine mainly uses ultrasonic bonding technology. The high-frequency sinusoidal power signal generated by the ultrasonic generator is transformed into mechanical vibration by piezoelectric ceramics. These vibrations act on the bonding interface through transmission amplification and convergence.
Because the thick aluminum wire has good electrical conductivity and mechanical strength, the thick aluminum wire bonding machine is widely used in the assembly of power devices, such as IGBT, MOSFET, etc., which can withstand large current and power.