Silver Adhesive Die Bonder

 The silver adhesive die bonding machine is a key equipment used to fix the chip to the substrate during the semiconductor assembly process.
Chip fixing: By adding silver adhesive to the substrate, the chip is precisely fixed to the substrate. Silver adhesive has good electrical and thermal conductivity, which can ensure reliable connection and heat conduction between the chip and the substrate.
High-precision positioning: The equipment adopts high-precision vision system and motion control system, which can realize the precise positioning and alignment of the chip, ensure the correct alignment of the chip and the substrate, and improve the accuracy and reliability of the assembly.
Automated operation: It has automatic feeding, dispensing, chip picking, placing and curing functions, which can reduce manual intervention and improve production efficiency and consistency.
It is widely used in various types of semiconductor chip assembly, such as integrated circuits, discrete components, optoelectronic devices, etc. During the assembly process, the silver adhesive die bonding machine is used to fix the chip to the substrate, laying the foundation for the subsequent packaging process.

Soft Solder Die Bonder

The soft solder die bonding machine is a key equipment used to fix the chip to the substrate during the semiconductor assembly process.
Chip fixing: By adding soft solder to the substrate, the chip is precisely fixed to the substrate. Soft solder is usually a metal alloy with a low melting point that is able to melt and form a good connection after heating.
High-precision positioning: The equipment adopts high-precision vision system and motion control system, which can realize the precise positioning and alignment of the chip, ensure the correct alignment of the chip and the substrate, and improve the accuracy and reliability of the assembly.
Automated operation: It has automatic feeding, dispensing, chip picking, placing and curing functions, which can reduce manual intervention and improve production efficiency and consistency.
It is widely used in various types of semiconductor chip assembly, such as integrated circuits, discrete components, optoelectronic devices, etc. During the assembly process, the soft solder die bonding machine is used to fix the chip to the substrate, laying the foundation for the subsequent packaging process.