No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
Dicing
Wafer dicing machine is a key equipment used in semiconductor manufacturing to cut wafer into a single chip, and the current mainstream equipment is divided into mechanical sawing dicing machine and laser sawing dicing machine.
Working principle:
Mechanical dicing: The traditional wafer dicing machine mainly uses mechanical dicing methods, using diamond blades to perform high-speed rotary dicing on the wafer. There is friction of blade with the wafer surface, by controlling the blade rotation speed and dicing depth, to achieve precise processing of the wafer.
Laser dicing: The use of high energy laser beam to cut the wafer, by precisely controlling the energy and focus of the laser, to achieve high precision dicing.
