No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
Back grinding
Wafer grinding machine is a key equipment used to thin wafer thickness in semiconductor manufacturing. Wafer grinding machine mainly uses grinding material and grinding technology to achieve wafer thinning. The grinding process is usually divided into three stages: rough grinding, fine grinding and polishing.
Rough grinding: Remove most of the excess material on the wafer surface, and the grinding amount is large, usually 50 to 150μm.
Fine grinding: Further remove trace amount of material to achieve predetermined thickness requirements, using finer grinding material particle size.
Polishing: Through liquid electrolytic polishing or physical polishing method to further smooth the wafer surface and improve its finish.
