No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
Process: Two chambers/ four wafers
Wafer size: 4-8 inches
Wafer material: Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, etc.
Removing material: PR, PI, C membrane removal, plasma cleaning and Descum process
Applications: IC, power devices, compound semiconductors, MEMS