Zhuozhou Xinyao Machinery Manufacturing Co., Ltd.

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  • Description

XS Plasma 1000

Process: Two chambers/ four wafers
Wafer size: 4-8 inches
Wafer material: Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, etc.
Removing material: PR, PI, C membrane removal, plasma cleaning and Descum process
Applications: IC, power devices, compound semiconductors, MEMS

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