Zhuozhou Xinyao Machinery Manufacturing Co., Ltd.

ICP

  

  • Description

XS Plasma 6000 ICP

Platform: 6-sided automation cluster
Max chambers: 4 chambers (MAX)
Wafer material: 4-8 inches: silicon, silicon carbide, gallium nitride, etc.
Etching materials: Silicon, polycrystalline silicon, deep silicon, silicon oxide, metal etching, etc.
Applicable fields: IC, power devices, compound semiconductors, MEMS, micro displays, micro nano optics, optical communication, etc.
 

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