No. 63 of Lousangmiao Village Songlindian Town,
Zhuozhou, Hebei, China.
diffusion furnace
Diffusion Oxidation Furnace (Production Type)
Application Range:
Suitable for semiconductor integrated circuits, advanced packaging, power and electronics (IGBT), micromachinery (MEMS), and Photovoltaic (PV) manufacturing and other fields.
Suitable for diffusion, oxidation, annealing, and alloying processes for 2-8 inch process sizes.
Technical Indicators:
Applicable wafer size: 2~8 inch
Working temperature: 600°C ~ 1300°C
Number of configured process tubes: 1~4 tube (s)/set (s)
Length and accuracy of constant temperature zone: ≤±0.5°C/600~800mm (800°C ~ 1300°C)
Single point temperature stability: ≤±0.5°C /24h (1100°C);
Temperature change rate: maximum heating rate 20°C/min, maximum cooling rate 5°C/min
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